CoAsia Signs Semiconductor Design Contract with U.S. On-Device AI Company
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[Seoul=Newsis] Reporter Kim Kyung-taek – CoAsia, a system semiconductor design house, announced on the 17th that it has signed a contract for the design and supply of edge AI semiconductors with an American company specializing in on-device AI processors.
According to the company, with this order, CoAsia has secured its second AI SoC (System on Chip) development project contract in the U.S. this year alone. Earlier this year, CoAsia signed a contract for the design and supply of semiconductors for generative AI geared towards HPC (High-Performance Computing) with a specialized AI platform development company in the U.S.
The company explained that this order was achieved due to the high evaluation of CoAsia’s capabilities in designing HPC, AI, and other ultra-fine advanced process big die semiconductors. They expect that this contract will also strengthen the ongoing AI SoC development projects in regions including Korea, Southeast Asia, and the U.S.
Dong-soo Shin, Head of CoAsia Semiconductor Division (CEO of CoAsia Semi), said, "This achievement is based on CoAsia's customer-centric and custom semiconductor design technology and continuous investment." He added, "We are confident that CoAsia will create more AI business opportunities in the global semiconductor markets of the U.S., Europe, and Southeast Asia."